比田井 洋史

The effects of the ambient temperature and relative humidity on crack propagation behavior during wheel scribing were investigated. A chamber was built to allow dynamic observation of crack propagation behavior in a controlled atmosphere. A developed miniature scriber was installed in the chamber, and the crack propagation behavior was observed from lateral and back sides during wheel scribing under various atmospheric conditions. As a result, the median crack propagation rate increased with relative humidity. We speculated that this was caused by the stress corrosion of glass. Although stress corrosion is considered to be more reactive at higher temperatures, the results of scribing at different temperatures showed that higher temperatures did not necessarily increase median crack propagation. This is due to the formation of lateral cracks before the median cracks have fully propagated. These results suggest that the interaction between multiple cracks should be considered when discussing the effects of temperature and humidity in wheel scribing.

固体イオン交換法によって銀イオン添加された試料に対し，電圧を印加することでガラス内に銀を析出させることができる．本手法は，ガラス内部に微細な導電路を形成する技術として期待されているが，析出物の形状制御手法が確立されていない．ここで，銀析出はき裂の生成をともなって進行することが確認されている．そこで本研究では，ホイール操作，レーザ照射を用いたき裂作成による析出物の誘導を行い，その原因を考察した．